■ Description: The thermal phase change material is a heat enhanced polymer designed to minimize the thermal resistance between power-consuming electronics and the heat sink connected to them. This small thermal resistance channel optimizes the performance of the heat sink and improves the reliability of microprocessors, memory modules DC/DC converters and power modules.
The key property of thermal conductive phase change material is its phase change characteristic. The material is solid at room temperature and easy to handle, and can be used as a dry mat for clean and sturdy use on the surface of heat sinks or devices. When the device operating temperature is reached, the phase change material becomes soft, and with a little tightening force, the material is easily integrated with the two mating surfaces like hot grease. This ability to completely fill the interfacial air gap and the gap between the device and the heat sink makes the phase change pad superior to the non-flowing elastomer or graphite-based heat pad and achieves properties similar to thermal grease.
Thermal phase change materials are not conductive, but because thermal phase change materials undergo phase change in the usual heat sink installation, there is a possibility of metal to metal contact, so the phase change materials can not be used as electrical insulation.
Small thermal resistance phase interface pad is not a structural bonding agent, can not directly connect the heat sink to the device, must use clamps or other mechanical fasteners to maintain the heat sink to the device clamping pressure.
■ Features and advantages: The solution is proven - the product has been used by PC manufacturers for more than a few years; Proven reliability - no shedding or air drying after 3000 temperature cycles; Customer touch cut shapes available (on light cut rolls)
52℃ or 58℃ phase change temperature; Thixotropic (lake viscosity) properties at operating temperature ensure that the material will not extend or drip when used in the vertical direction; It does not conduct electricity.
■ Typical applications: microprocessor, memory module, DC/DC converter, IGBT module, power module, power semiconductor device, solid state relay, bridge rectifier, cache chip