Ceramic materials have the characteristics of good insulation, high thermal conductivity, large infrared emissivity and low expansion coefficient, and can become a new material for heat dissipation of LED lighting and network communication products; Can withstand high current, can withstand high voltage, can prevent leakage and breakdown, no noise, will not produce coupling parasitic capacitance with MOS and other power tubes, and therefore simplify the filtering process; The required creepage distance is shorter than that required by the financial body, which further saves the board space and weight; More conducive to engineer design and electrical certification; The multi-directional heat dissipation is more suitable for the packaging method of IC with multi-directional heat dissipation; The material is small in volume, light in weight, does not occupy space, and is more conducive to the reasonable layout of product design; Good heat dissipation and heat transfer performance, can effectively solve the heat dissipation problem of electronic products and power components, and extend the service life of products. Can replace the aluminum radiator, can be single-side glue.